PCM XK-C16
Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Good electrical insulation Applications Power semiconductor CPU and GPU Power conversion Description XK-C16 is a kapton(PI) reinforced, high performance thermal material with excellent dielectric peroperties, this product is solid pad at room temperature for ease of assembly, above its phase change temperature, it will soften or liquifiy and wet out interface, improving interface contact and providing lower thermal contact resistance.
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XK-D12 |
Features
Fillinggapsbetweenheatsourceandheatsink
Excellentelectricalinsulation,bondstrength≥13Mpa
Applicationtemperature:-45~175℃,Shortterm:25... |
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XK-D20L |
Features
Thermalconductivity2.0W/(m.K),lowstress
Excellentelectricalinsulation,bondingstrength≥13Mpa
Applicationtemperature:-45~175℃,Shortterm... |
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XK-S25 |
Features
High performance
Conforming, ideal for delicate conponent
and low stress applications
Cure at room or elevated temperature
1:1, no cure ... |
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XK-G20 |
Features
High thermal performance
Low thermal resistance
Ultra thin bondline
Conforming with wet out
Design for low stress application
Applic... |
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XK-GN15 |
Features
High thermal performance
Low thermal resistance
Ultra conforming
Low stress
Applications
Automotive electronics
Comsumer electroni... |
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