PCM XK-C16
Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Good electrical insulation Applications Power semiconductor CPU and GPU Power conversion Description XK-C16 is a kapton(PI) reinforced, high performance thermal material with excellent dielectric peroperties, this product is solid pad at room temperature for ease of assembly, above its phase change temperature, it will soften or liquifiy and wet out interface, improving interface contact and providing lower thermal contact resistance.
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XK-G50 |
Features
Thermal conductivity 5.0W/mK
Low thermal resistance
Ultra thin bondline
Conforming with wet out
Design for low stress application
App... |
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XK-S30 |
Features
Thermal conductivity 3.0W/mK
Conforming, ideal for delicate conponent
and low stress applications
Cure at room or elevated temperature
1... |
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XK-P60 |
Features
Thermal conductivity 6.0W/mK
Low thermal impedance
Good electrical insualtion
Easeofhandling
Applications
Automotive electronics
Di... |
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XK-D30 |
Features
Thermalconductivity3.0W/(m.K),flammabilityUL94-V0
Excellentelectricalinsulation,bondingstrength≥13Mpa
Applicationtemperature:-45~123℃... |
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XK-D20L |
Features
Thermalconductivity2.0W/(m.K),lowstress
Excellentelectricalinsulation,bondingstrength≥13Mpa
Applicationtemperature:-45~175℃,Shortterm... |
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