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FPC UV Laser Cutting Machine JG18

Laser Cutting Machine

Usage

The machine is used to cut cover layer CVL, flex printed circuit board FPC, flex-rigid circuit board RF. Includes base materials, such as: silicon, ceramics, rubber, FR4, 3M, PP, PI reinforcement; with high quality, high speed cutting thickness of up to 1mm (0.04). There is no burrs, no stratification. The cutting edge and sidewall is smooth.

Feature

1、Precision:Adopting linear motor module,Servo control, sizing compensation, optical positioning and secondary positioning technologies.

2、High quality: Little carbonization and high density graphics cutting.

3、Highly intelligent、efficient:With multi-panels cutting、auto-positioning、auto-correcting、automatic sizing compensation and exclusive cutting previews functions.

Parametres

Specification of href="" UV Laser Cutting Machine

Model

JG18

Wavelength

355nm

Laser Power

Option (Standard10W)

Laser Frequency

30-120kHz

Maximum Processing Size

720mm x540mm

(Double platform)

Maximum Operating Speed

800mm/s

Positioning Accuracy of Table

±3μm

Repetitive Positioning Accuracy of Table

±1μm

Total Accuracy

±20um

light spots

20±5μm

Scanning range

45mmx45mm

File Format

*.gbr & *.dxf & *.lay

Electric Power Supply

AC220V/2kW;AC380V/5.5kW

Dimensions(L x W x H)

1780mmx1610mmx1650mm

Weight

2300kg

Environmental Temperature

20±2℃

Environmental Humidity

≤60%RH,Non-condensing

Ground Amplitude

≤5μm

Ground Pressure

≥1000Kgf/m2



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