FPC UV Laser Cutting Machine JG18
Laser Cutting Machine
Usage
The machine is used to cut cover layer CVL, flex printed circuit board FPC, flex-rigid circuit board RF. Includes base materials, such as: silicon, ceramics, rubber, FR4, 3M, PP, PI reinforcement; with high quality, high speed cutting thickness of up to 1mm (0.04). There is no burrs, no stratification. The cutting edge and sidewall is smooth.
Feature
1、Precision：Adopting linear motor module，Servo control, sizing compensation, optical positioning and secondary positioning technologies.
2、High quality: Little carbonization and high density graphics cutting.
3、Highly intelligent、efficient：With multi-panels cutting、auto-positioning、auto-correcting、automatic sizing compensation and exclusive cutting previews functions.
Parametres
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Specification of href="" UV Laser Cutting Machine |
|
|
Model |
JG18 |
|
Wavelength |
355nm |
|
Laser Power |
Option (Standard10W) |
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Laser Frequency |
30-120kHz |
|
Maximum Processing Size |
720mm x540mm (Double platform） |
|
Maximum Operating Speed |
800mm/s |
|
Positioning Accuracy of Table |
±3μm |
|
Repetitive Positioning Accuracy of Table |
±1μm |
|
Total Accuracy |
±20um |
|
light spots |
20±5μm |
|
Scanning range |
45mmx45mm |
|
File Format |
*.gbr & *.dxf & *.lay |
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Electric Power Supply |
AC220V/2kW；AC380V/5.5kW |
|
Dimensions(L x W x H) |
1780mmx1610mmx1650mm |
|
Weight |
2300kg |
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Environmental Temperature |
20±2℃ |
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Environmental Humidity |
≤60%RH,Non-condensing |
|
Ground Amplitude |
≤5μm |
|
Ground Pressure |
≥1000Kgf/m2 |
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