.

XK-G32

Features

High thermal performance

Low thermal resistance

Ultra thin bondline

Conforming with wet out

Design for low stress application

Applications

Automotive electronics

Comsumer electronics

Telecommunications

Computer and peripherals

Description

Title.png

XK-G30is a high performance, excellent thermal management solution for electronics assemblies. It is formulated to accommodate a variety of different bondline thickness and provide low thermal impedanceat any gaps.XK-G30 thermal gel is compatible with high volume, automated dispensingprocess.

GLPOLY performance thermal gel has features and benefits:

1. Applied in DJI drones with proven reliability in extreme temperature cycling and thermal shock;

2. Particle size is as small as 1μm, 30% smaller than peers’, filling rate is 20% higher than that of peers;

3. Supplied in one-component, non-curing, wetting-out interface, decreasing thermal resistance;

4. Compatible with high volume, automated dispense processes;

5. Deforms under low pressure, decreasing stress on component thus decreasing component failures;

6. The first one that imports automated production lines, eliminating human error;



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Кому: Shenzhen Goldlink Tongda electronics Co,.Ltd
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