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XK-G32

Features

High thermal performance

Low thermal resistance

Ultra thin bondline

Conforming with wet out

Design for low stress application

Applications

Automotive electronics

Comsumer electronics

Telecommunications

Computer and peripherals

Description

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XK-G30is a high performance, excellent thermal management solution for electronics assemblies. It is formulated to accommodate a variety of different bondline thickness and provide low thermal impedanceat any gaps.XK-G30 thermal gel is compatible with high volume, automated dispensingprocess.

GLPOLY performance thermal gel has features and benefits:

1. Applied in DJI drones with proven reliability in extreme temperature cycling and thermal shock;

2. Particle size is as small as 1μm, 30% smaller than peers’, filling rate is 20% higher than that of peers;

3. Supplied in one-component, non-curing, wetting-out interface, decreasing thermal resistance;

4. Compatible with high volume, automated dispense processes;

5. Deforms under low pressure, decreasing stress on component thus decreasing component failures;

6. The first one that imports automated production lines, eliminating human error;



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