Dicing Blades Without Hub
The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc.
Performance of Dicing BladesWithout Hub
Strong cutting ability
High accuracy
The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm
Applications of ultra thin diamond bladeWithout Hub
For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.
E grind, as an excellent diamond wheel manufacturer, offers a wide range of resin bonded grinding wheelsfor you to choose from.
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