Dicing Blades Without Hub
The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc.
Performance of Dicing BladesWithout Hub
Strong cutting ability
High accuracy
The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm
Applications of ultra thin diamond bladeWithout Hub
For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.
E grind, as an excellent diamond wheel manufacturer, offers a wide range of resin bonded grinding wheelsfor you to choose from.
Отправить запрос, связаться с поставщиком
Другие товары поставщика
 |
Vitrified Bond Grinding Wheels | The diamond and vitrifiedCBNare held in place by ceramic components that are fused to form the abrasive part of vitrified bond diamond grinding whe... |
 |
Cut Off Wheels | E-Grind Abrasives developed diamond blade cut off wheel/CBN cut off blade for grinderto achieve more efficient and precision cutting. Our general b... |
 |
Wafer Back Grinding Wheel | E-Grind BackGrinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity t... |
 |
Metal Bond Diamond Grinding Wheels | The metal bonded diamond grinding wheels are made from the sintering of alloy powders and other fillers with either diamond grains or CBN grains. U... |
 |
Dicing Blades With Hub | Disco Diamond Blade Our Disco dicing bladewith Hub is with a stronger edge, which makes the diamond blade discomore rigid and keeps the edge not t... |
Похожие товары
 |
MaAnt M086A M086B curved screen removal blade for disassembling mobile phone/laptop LCD screen | Продавец: Phonefix | Описание товара Лезвие для снятия изогнутого экрана MaAnt M086A M086B используется для снятия ЖК-... |
 |
2UUL DA19 RollStop Solder Blade Set Tin Scraper for Mobile Phone CPU Soldering Repair | Продавец: Phonefix | Описание товара Набор скребков для удаления припоя 2UUL DA19 RollStop для ремонта процессоров моб... |
 |
2UUL DA28 FlatCut Mobile Phone Filling Glue Quick Removal Blade Suitable for Mobile Phone PCB CPU IC Glue Cleaning and Removal | Продавец: Phonefix | Описание продукта 2UUL DA28 FlatCut Solder Pad Underfill Glue Quick Removal Blade (5 шт./коробка)... |
 |
MIJING TC-10 Ceramic Knife Suit Carving Blade IC Glue Removal | Продавец: Shenzhen Wikshu Technology Co. | Описание MIJING TC-10 керамический нож костюм 3 в 1 нож ручка с лезвием для мобильного телефона C... |
|
|
Dicing Blades Without Hub | Продавец: Henan E-Grind Abrasives Co., Ltd. | The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith... |
