.

Dicing Blades Without Hub

The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc.

Performance of Dicing BladesWithout Hub

Strong cutting ability

High accuracy

The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm

Applications of ultra thin diamond bladeWithout Hub

For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.

E grind, as an excellent diamond wheel manufacturer, offers a wide range of resin bonded grinding wheelsfor you to choose from.



Отправить запрос, связаться с поставщиком

Кому: Henan E-Grind Abrasives Co., Ltd.
Ваш E-mail:
Текст письма:


Send to other suppliers

Другие товары поставщика

Diamond And CBN Grinding Wheels
Diamond And CBN Grinding Wheels As one of the reputable cbn grinding wheel manufacturers, Egrindprovides different types of abrasive wheelsand Cubic Boron Nitride (CBN) grinding...
Crankshaft, Camshaft & Cylindrical Grinding Wheels
Crankshaft, Camshaft & Cylindrical Grinding Wheels E-Grind provides vitrified bond CBN wheels for grinding automobile camshafts, crankshafts, and cylinders in the air-compressor industry. Optimum bo...
Wafer Back Grinding Wheel
Wafer Back Grinding Wheel E-Grind BackGrinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity t...
Diamond Grinding Wheel Dresser
Diamond Grinding Wheel Dresser E-Grind developed diamond grinding stone dressers widely used in many metalwork industries like auto parts, engine and engine parts, mold, cutting ...
Wafer Back Grinding Wheel
Wafer Back Grinding Wheel E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity ...
Все товары поставщика

Похожие товары

MIJING TC-10 Ceramic Knife Suit Carving Blade IC Glue Removal
MIJING TC-10 Ceramic Knife Suit Carving Blade IC Glue Removal Продавец: Shenzhen Wikshu Technology Co. Описание MIJING TC-10 керамический нож костюм 3 в 1 нож ручка с лезвием для мобильного телефона C...
Dicing Blades Without Hub
Dicing Blades Without Hub Продавец: Henan E-Grind Abrasives Co., Ltd. The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith...
Dicing Blades With Hub
Dicing Blades With Hub Продавец: Henan E-Grind Abrasives Co., Ltd. Disco Diamond Blade Our Disco dicing bladewith Hub is with a stronger edge, which makes the diam...
Laser Welding Saw Blade
Laser Welding Saw Blade Продавец: Shijiazhuang Osprey Tools Co., Ltd The diamond impregnated segments and the steel core were laser welded in a horizontal arrangemen...
General Diamond Saw Blade
General Diamond Saw Blade Продавец: Shijiazhuang Osprey Tools Co., Ltd Segmented Sintered Item Nr. Diameter(mm) Arbor(mm) 1RGR105 105 8/10 ...