25Gbps Ceramic Leadless Chip Carriers (CLCC) for Modulator Drivers
Surface Mount Packages
Low Insertion Loss: -1dB min. (DC~32GHz)
Low Return Loss: -15dB max. (DC~32GHz)
Cu-Mo Heat Sink
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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