25Gbps Ceramic Leadless Chip Carriers (CLCC) for Modulator Drivers
Surface Mount Packages
Low Insertion Loss: -1dB min. (DC~32GHz)
Low Return Loss: -15dB max. (DC~32GHz)
Cu-Mo Heat Sink
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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TO-254 and TO-257 Ceramic Packages for Power Electronics | Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies Sinopack devotes to the R&D and manufacturing of mu... |
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Sinopack 40Gbps TOSA / ROSA Ceramic Packages for LR4 | TOSA / ROSA Packages for QSFP+ Transceivers, Surface Mount Packages, XLMD-MSA Compliant BTF PKG Sinopack devotes to the R&D and manufacturing o... |
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100Gbps Packages for Integrated Coherent Receivers (ICR) Gen 1.2 | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch with 0.8/1.0mm pitch Sinopack devotes to the R&D and manufacturing of ... |
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