TO-254 and TO-257 Ceramic Packages for Power Electronics
Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack 40Gbps TOSA / ROSA Ceramic Packages for LR4 | TOSA / ROSA Packages for QSFP+ Transceivers, Surface Mount Packages, XLMD-MSA Compliant BTF PKG Sinopack devotes to the R&D and manufacturing o... |
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100Gbps TOSA / ROSA Packages for CFP4 / QSFP28 Transceivers | These packages feature Ceramic-to-metal feed-thru leads for optimal function and reliability. Metal body with standard or custom heat sink material... |
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100Gbps Packages for Integrated Coherent Receivers (ICR) Gen 1.2 | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch with 0.8/1.0mm pitch Sinopack devotes to the R&D and manufacturing of ... |
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25Gbps Cooled TOSA Ceramic Packages with lids | Box packaging style with ceramic and metal structure, TEC attachable Structure. High frequency used for 100Gbps 10km/40km. Low Return Loss: -15dB m... |
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Surface Mount Ceramic Packages for Electronic Devices | Sinopack provides miniaturized surface mount ceramic packages with cavity structures available . Hermetic or vacuum-sealing is typically applied to... |
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