Surface Mount Ceramic Packages for Electronic Devices
Sinopack provides miniaturized surface mount ceramic packages with cavity structures available . Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... | |
Glass-Metal Hermetic Feedthroughs Packages for industrial manufacturing machinery | Sinopack provides glass hermetic feedthroughs and connectors based on its glass-to-metal sealing technology. These glass hermetic feedthroughs are ... | |
Custom-Designed Ceramic Packages and Optical Filters for Image Sensors | Sinopack provides standard and custom-designed ceramic packages for CCD and CMOS image sensors. Sinopack devotes to the R&D and manufacturing o... | |
Sinopack Ceramic Packages for High Power Laser Devices | Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conduct... | |
Sinopack Hermetic Ceramic Packages for MEMS Sensors | Sinopack offers hermetic ceramic packages with superior mechanical properties, suitable for small, high density, and surface mountable applications... |
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