Surface Mount Ceramic Packages for Electronic Devices
Sinopack provides miniaturized surface mount ceramic packages with cavity structures available . Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Butterfly Ceramic Packages for Integrable Tunable Laser Assembly (ITLA) | Low Return Loss: -20dB max. (DC~15GHz) Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC,... |
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TO-254 and TO-257 Ceramic Packages for Power Electronics | Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies Sinopack devotes to the R&D and manufacturing of mu... |
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High Baud Rate Ceramic Packages for Integrated Coherent Receiver (ICR) | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch Sinopack devotes to the R&D and manufacturing of multilayer ceramic pa... |
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25Gbps Cooled TOSA Ceramic Packages with lids | Box packaging style with ceramic and metal structure, TEC attachable Structure. High frequency used for 100Gbps 10km/40km. Low Return Loss: -15dB m... |
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