Surface Mount Ceramic Packages for Electronic Devices
Sinopack provides miniaturized surface mount ceramic packages with cavity structures available . Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Other supplier products
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Sinopack Ceramic Packages for Uncooled Infrared Detectors | Existing packages using BTF structure, oxygen-free copper and package integration, has the characteristics of more fuses, high reliability. Maximum... |
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Sinopack Ceramic Packages for Cooled Infrared Detectors | Ceramic Packages for Cooled Infrared Detectors plays a high airtight work condition, mechanical support and protection, the function of the circuit... |
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Glass-Metal Hermetic Feedthroughs Packages for industrial manufacturing machinery | Sinopack provides glass hermetic feedthroughs and connectors based on its glass-to-metal sealing technology. These glass hermetic feedthroughs are ... |
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25Gbps Ceramic Leadless Chip Carriers (CLCC) for Modulator Drivers | Surface Mount Packages Low Insertion Loss: -1dB min. (DC~32GHz) Low Return Loss: -15dB max. (DC~32GHz) Cu-Mo Heat Sink Sinopack devotes to the R&am... |
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100Gbps TOSA / ROSA Packages for CFP4 / QSFP28 Transceivers | These packages feature Ceramic-to-metal feed-thru leads for optimal function and reliability. Metal body with standard or custom heat sink material... |
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