Sinopack Ceramic Packages Manufacturer for Wireless Communication Devices
Sinopack provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistance and heat sinks with high thermal conductivity are available for high power devices.
Sinopack also supplies thin-film-metallized ceramic substrates for hybrid MICs, in addition to MMIC packages that feature options of feedthrough, RF via, and electro-magnetic coupling structures suitable for frequencies up to 90GHz and beyond.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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| 100Gbps Packages for Integrated Coherent Receivers (ICR) Gen 1.2 | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch with 0.8/1.0mm pitch Sinopack devotes to the R&D and manufacturing of ... | |
| Sinopack Ceramic Packages Manufacturer for Wireless Communication Devices | Sinopack provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistan... | |
| Sinopack 40Gbps TOSA / ROSA Ceramic Packages for LR4 | TOSA / ROSA Packages for QSFP+ Transceivers, Surface Mount Packages, XLMD-MSA Compliant BTF PKG Sinopack devotes to the R&D and manufacturing o... | |
| 100Gbps TOSA / ROSA Packages for CFP4 / QSFP28 Transceivers | These packages feature Ceramic-to-metal feed-thru leads for optimal function and reliability. Metal body with standard or custom heat sink material... | |
| Sinopack Ceramic Packages for Uncooled Infrared Detectors | Existing packages using BTF structure, oxygen-free copper and package integration, has the characteristics of more fuses, high reliability. Maximum... |
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