SCM3000 M2M Chip Personalization Machine
The M2M Chip Personalization Machine SCM3000can conduct chip electrical performance test, chip encoding and surface laser marking for M2M chips in QFN, DFN, VSOP8 and other packaging forms, automotive electronic SE (Security Element), eSIM and other smart devices.
SCM3000 can provide high-speed, stable and safe personalization production services for global mobile operators, smart device OEMs, and automotive electronic security chip manufacturers. During the past six years since 2017, nearly 500 million chips have been produced for more than dozens of factories.
Specifications of SCM3000 M2M Chip Personalization Machine
PARAMETER
|
Capacity |
2500/uph |
|
Overall Dimension |
1850mm X 1600mm X 1750mm |
|
Weight |
600kg |
|
Power Source |
220V(-5%~+10%), 50Hz, 6KW |
|
Noise |
＜65dB |
|
Operating Temperature |
23℃±3℃ |
|
Working Humidity |
50±10% |
|
Compressed Air |
stress: 0.5Mpa Flow rate: 300LPM |
|
Communication Interface |
Ethernet |
Fuctions of SCM3000 M2M Chip Personalising Machine
PARAMETER
Input Module
Chip Rotating Module
- ° and forward.
- ° rotations by identifying the mark point on the chip.
IC Perso Module
Laser Marking Module
IC Verification Module
OCR Verification Module
Equipped with a set of 5 million pixel industrial camera (including light source).
Reject Module
Equipped with 8 reject boxes.
Chips which fail to be encoded or marked can be rejected automatically and stored in different categories to reduce material loss and labor costs.
Output Module
Tray Output: up to 20pcs of trays can be loaded.
Tape Output: Compatible with tape rolls in 1000pcs and 3000pcs.
Compatible with tray and tape output for chips packaging.
Advantages of SCM3000 M2M Chip Personalization Machine
WHY
High Stability
Rejecting rate is less than 1/1000.
Downtime for 100-hour failure is not exceed 30 minutes.
High-precision of mechanical carrying mechanism can handle chips down to 2*2mm.
High Compatibility
Dozens of chips in different froms and specifications can be supported, and switching time is less than 20 minutes.
Compatible for both tray and tape for input and output.
Secondary development is fully supported to meet various customized requirements.
High Productivity
The instant production capacity can reach 2500 chips/hour.
The throughput can reach 1,300,000 chips/month.
High Cost-performance Ratio
The customer procurement costs can be reduced by 15% due to variety of self-developed core technologies integrated.
The maintenance costs can be reduced by 20% with less wearing and longer service life.
As one of smart card manufacturers, we will do our best to meet all the needs of customers.
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