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Professional repair efficiency starts with precision tools.

Introducing the YCS integrated BGA reballing stencil designed for the full iPad series, specially engineered for both CPU and Nand IC chips. This all-in-one steel stencil combines high-precision laser cutting, uniform aperture size, and stable positioning to ensure clean, accurate tin planting without bridging, missing balls, or offset.

Made with high-strength, wear-resistant steel, it maintains flatness during long-term use, is easy to clean, and can be reused multiple times—greatly reducing material costs and improving repair success rates. Whether you are performing motherboard maintenance, chip replacement, Nand upgrade, or fault repair, this stencil provides stable and consistent results for various iPad models.

Simplify your workflow, unify your tooling, and upgrade your repair quality with one professional integrated reballing stencil.