Tri-Temperature Test Product
Tri-Temperature Test Product
Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging.
Tri-Temperature Test Handler— Precision Thermal Test
Our Tri-Temperature Test Handler delivers reliable, repeatable thermal testing across the full tri-temp spectrum so you can validate device performance where it matters most — from extreme cold to high heat. Designed for engineering labs and scalable to production lines, this handler combines precise thermal control, high throughput multi-site testing, and broad device compatibility to shorten time-to-market and reduce test costs.
Benefits ofTri-Temperature Handler
·Wide, industry-grade temperature range for true tri-temp testing (cold → ambient → hot), supporting the full range of device characterization and qualification needs.
·Active thermal control (ATC) and multi-zone temperature management keep DUT temperatures stable and uniform during high-power or long soak tests, improving data quality and yield.
·Multi-site parallel testing and optimized handling mechanics deliver high units-per-hour throughput while minimizing jams and socket wear — ideal forsemiconductor productionand high-volume validation.
·Flexible cooling/heating architectures (LN₂ or modern refrigerant thermal engines) let you match performance to cost and facility constraints.
·Engineered to support a wide array of package types (QFN, BGA, QFP, TO-packages, SOT23, etc.) and easy kit changeover for fast product mix-shifts.
Technical Highlights
·Full tri-temp capability with precision thermal control for accurate soak and transition cycles.
·Configurable parallelism (single-site up to multi-site arrays) so you can prioritize throughput or per-device characterization as required.
·Industry-proven sockets, thermal engines, and pre-heat designs that integrate seamlessly with ATE test heads and common production workflows.
·Robust mechanical design for long MTBF and easy maintenance — reduces downtime and total cost of ownership.
About us:
在线联系供应商
Other supplier products
|
|
Tri-Temperature Test Product | Tri-Temperature Test Product Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Tri-T... |
 |
Test Handler | Test Handler Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Afinaltest handleris ... |
 |
Press Fit Machine | Press Fit Machine Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Automatic Press-... |
 |
Automated Optical Inspection System | Automated Optical Inspection System Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging.... |
 |
Die Bonder | Die Bonder Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Die Bonding Manufacture... |
Same products
 |
GT-FM24-PLC填粉机机(3+9+9+3)三导管 | 卖方: 肇庆古雷特科技有限公司 | * 描述 GT-FM-PLC（6-48工位三导管）氧化镁粉灌装机，是在GT-FM-PLC（6-48工位双导管）的基础上改进而成。 双导管灌装机与三导管灌装机的主要区别如下： 三导管灌装机可以在一... |
 |
High Speed Flat Wire Coil Winding Machine for EV Traction Motor Manufacturing | 卖方: Eurion Automation Co., Ltd. | 高精度伺服控制系统：采用工控级电脑控制平台，配套进口伺服电机与减速机，确保运行高效、精准、稳定。 六轴联动结构设计：送线轴、绕线轴、排线轴及手臂成型轴独立控制、协同配合，实现多工序复合成型。 ... |
 |
GT-FM18-PLC灌装机(8+2+8)三导管 | 卖方: 肇庆古雷特科技有限公司 | * 描述 GT-FM-PLC（6-48工位三导管）氧化镁粉灌装机，是在GT-FM-PLC（6-48工位双导管）的基础上改进而成。 双导管灌装机与三导管灌装机的主要区别如下： 三导管灌装机可以在一... |
 |
48工位填粉机 GT-FM48 | 卖方: 肇庆古雷特科技有限公司 | * 描述FM灌装机适用于长长度、不同直径的管式加热器的灌装。 FM填充机填充的加热器具有高密度，根据直径、氧化镁粉末、填充速度，密度可达2.3g/cm3。 FM灌装机有双导管灌装机和三导管灌装机... |
 |
8工位填粉机 GT-FM8 | 卖方: 肇庆古雷特科技有限公司 | * 描述 FM灌装机适用于长长度、不同直径的管式加热器的灌装。 FM填充机填充的加热器具有高密度，根据直径、氧化镁粉末、填充速度，密度可达2.3g/cm3。 FM灌装机有双导管灌装机和三导管灌装... |
