LED Encapsulation Materials for General Lighting
Good adhesion to metals, chips and other substrates
Good sulfur resistance and thermal shock performance
Translucent appearance
Applications
● Encapsulation for LED lighting components
● Encapsulation for LED backlight components
● Encapsulation for Auto LED lighting components
It is a kind of two-part, high temperature cure silicone resin, which is designed forSMD LED encapsulationand suitable for protection of chips and gold wire. The typical features are translucent appearance, good light transmission, sulfur resistance, excellent thermal shock performance, and good adhesion to frame and silver-plated coatings.
Specifications
|
Properties |
8103 |
8105 |
7097S |
8232 |
7098 |
8225 |
8136 |
8228 |
5004 |
5005S |
8157 |
7136 |
|
Mix ratio |
1:10 |
1:10 |
1:10 |
1:10 |
1:10 |
1:10 |
1:10 |
1:10 |
1:4 |
1:4 |
1:1 |
1:10 |
|
Viscosity |
5200 |
4000 |
4600 |
4000 |
5300 |
3500 |
4300 |
4500 |
4000 |
4200 |
3600 |
4000 |
|
Refractive Index |
||||||||||||
|
Cure Condition |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
100℃*1hr, 150℃*3hr |
|
Shore Hardness |
D74 |
D62 |
D66 |
D62 |
D62 |
D65 |
D49 |
D45 |
A78 |
A75 |
A70 |
A55 |
|
Tensile Strength Mpa |
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