CPU Thermally conductive pad
it is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.
Features & benefits:
1.High compressibility, soft and flexible, designed for applications in low-stress application environment
2. Nice thermal conductivity
3. Electrical insulation
4. Meet with the environmental requirements of ROHS and UL
5. Natural stickiness
Typical applications:
1 .Laptop
2. Communication hardware equipment
3. High-speed hard disk drive equipment
4. Automobile engine control mould
5. Micro processor, memory chip and graphics processor
6 Mobile equipment
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