Thermal gap filler with carrier for thermal insulating application

ROHS Compliant: Yes
UL recognized: Yes
Features and Benefits:
Thermal conductivity: 1.0-8.0 W/m·K
Excellent thermal performance
Low oil-bleeding
High tack surface reduces contact resistance
Available in die-cut parts and sheets
Available in self-adhesive or one-sided self-adhesive

Application:
1.Used between IC and heat sink, or chassis;
2.Used between a semiconductor and heat sink;
3.Used to cool CD-ROM/DVD, hard drive;
4.Power supply;
5.Between a CPU and a heat spreader;
6.Between PC boards and heat sinks or a metal chassis;
7.Military, medical devices and industrial controls;
8.Areas where heat needs to be transferred to the heat spreader

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