.

Fast and Effective Solder Removal for Electronics

WYLIE 3M 除焊芯 2.0mm 2.5mm 3.0mm 3.5mm 3.0M 焊锡丝采用拇指轮分配器和不锈钢嘴设计,适用于手机主板、电子电路板、CPU BGA芯片、锡清洗焊接维修。残留物少、抗氧化、除焊能力强等特点。规格多样,除焊速度快,清洁力强,适用于焊接除焊剂除焊。

选项:
1x WL-1530
1x WL-2030
1x WL-2530
1x WL-3030
1x WL-3530

特点:
1.新一代除焊丝,适用于除焊各类电子元件、精密电子设备维修。
2.无卤素,超低残留,清澈透明,易清洗,拆焊速度快,适用于各类需要拆焊的电子元器件。
3.铜线精密编织,软硬适中,不易铺展,拆焊时高效吸收多余锡渣,焊孔干净,残留低。
4.防烫散热嘴,不锈钢材质,隔热防烫,不易烫伤。
5.扭线转盘,方便存放及回收闲置编织铜线。



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