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BGA132 IC test sockets | testing solution of chip

ShenzhenYounRongDamicroelectronicstechnologyco.Ltdisaprofessionalsemiconductortestprogramdevelopment,manufacturingandsalesenterprises,withtenyearsofresearchandtestingsocketmakingexperience,.Wemainlyprovidechiptestsocket,burningfixture,programmingdevice,EMMC/TSOPtestsocket,camerachiptestsocket(sensor),automatedtestsocketandconnectortesting.

Contact:Gracexie

Email:sabbatiaat163dotcom

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BGA132socketsfeature

  1. Uppercoveradoptclamshell-rollerstructure,sensitiveoperation.2.Pressplateofsocketheadadopthumanizationstructure,balancepress,guaranteeICpressequality,andwon’tskewing.3.CrownshapeofPogopinbeabletobreakoxidelayerofsolderball,contactstable,protectsolderballshape.4.Rationalizationlocatingslot,GuideholecanmakesureIClocationright.5SpecialICsupportplatestructure,protectPogopinfreeofoutsideforce.
  2. importPogopin,BECUplatedhardgolden,rhodium.Worklifetimeover100000times.
  3. Lowcostformaintenance,easytochangepin,costefficiency.
  4. Matureworkingaccuracyrange:pitch=0.3mm

10.Deliverytime:inthreedaysearliest.



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