BGA 268 test sockets BGA 268 testing /testing solution
ShenzhenYounRongDamicroelectronicstechnologyco.Ltdisaprofessionalsemiconductortestprogramdevelopment,manufacturingandsalesenterprises,withtenyearsofresearchandtestingsocketmakingexperience,.Wemainlyprovidechiptestsocket,burningfixture,programmingdevice,EMMC/TSOPtestsocket,camerachiptestsocket(sensor),automatedtestsocketandconnectortesting.
Contact:Gracexie
Email:sabbatiaat163dotcom
Phone:
Mobile:
BGA268testsocketfeature
SIZE:17X17(mm)
Pin:268
PITCH:0.8
- Uppercoveradopthandrotatestructure,sensitiveoperation.2.Pressplateofsocketheadadopthumanizationstructure,balancepress,guaranteeICpressequality,andwon’tskewing.3.CrownshapeofPogopinbeabletobreakoxidelayerofsolderball,contactstable,protectsolderballshape.4.Rationalizationlocatingslot,GuideholecanmakesureIClocationright.5SpecialICsupportplatestructure,protectPogopinfreeofoutsideforce.
- importPogopin,BECUplatedhardgolden,rhodium.Worklifetimeover100000times.
- Lowcostformaintenance,easytochangepin,costefficiency.
- Matureworkingaccuracyrange:pitch=0.3mm
10.Deliverytime:inthreedaysearliest.
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