Chemical Mechanical Planarization Systems
Whats/App: +86 156 1874 6768
Web: standard-groups.com
Application
The Chemical Mechanical Polisher is widely used in laboratory and pilot-scale environments for polishing process optimization and material behavior studies, including:
Semiconductor wafer polishing (Si, GaN and related substrates)
Optical component surface finishing
Substrate and thin material planarization
Aerospace material surface preparation
Research on friction, wear, and material removal mechanisms
Typical test objects include semiconductor wafers, optical substrates, bonded pads, and development samples with diameters from 0.5 inch to 4.25 inches.
Standards
The system is primarily intended for research and development applications. It supports experimental setups and evaluation methods commonly referenced in:
(1) Semiconductor CMP process research practices
(2) Optical surface finishing and planarization studies
(3) Tribology and wear mechanism investigation methods
Specific test standards depend on user-defined processes and research objectives.
Parameters
| Item | Description |
|---|---|
| Load Control | Closed-loop loading force control with high-precision force sensor |
| Torque Measurement | High-resolution online torque measurement |
| Wafer Holder | Self-leveling fixture with active rotation and horizontal oscillation |
| Sample Size Range | 0.5 inch to 4.25 inches |
| Platform | Fully automated XY platform with quick-change capability |
| Speed Control | Wide adjustable speed range via programmable control |
| Slurry Delivery | Automatic slurry delivery system |
| Inline Sensors | Torque, temperature, and acoustic emission |
| Surface Measurement | Integrated inline three-dimensional optical profiler |
Accessories
(1) Self-leveling wafer fixture
(2) Quick-change wafer and pad holders
(3) Automatic slurry delivery system
(4) Inline torque sensor
(5) Acoustic emission sensor
(6) Online temperature monitoring module
(7) Integrated 3D optical profiler
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