Pico Laser Cutting Machine JG16B
Laser Cutting Machine
Product Name:Pico Laser Cutting MachineBrand Name:ASIDAModel Number:JG16BCertification:CEPlace of Origin:ChinaPackaging Details:Wooden Carton
Usage
The machine is mainly used for coverlayer (CVL) cutting, flexible board (FPC) outline cutting, rigid-flexible circuit board (RF) cutting ,and thin multi-layer board cutting, as well as ceramics, silicon, aluminum foil, teflon, display glass etc..
Feature
1, Less carbonization:
laser pulse width is less than 10 picosecond, thermal influence is minimum,so the carbonization is little.
2, High speed:
picosecond repetition frequency is very high and galvanometer speed is up to 3000mm / s,so cutting speed of pico laser machine is double compared with nanosecond laser cutting machine.
3, Good cutting effect:
Pico laser machine processwitha small single pulse energy, high frequency processing, soprocessing surface is moresmooth;
4,Applied for various materials
Coverlayer,circuit board,copper foil ,ceramics, silicon, Teflon, display glass,etc.
Parametres
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Specifications of Pico Laser Cutting MachineJG16B |
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Item |
Specifications |
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Laser source |
UV pico laser |
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wavelength |
355nm |
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Pulse width |
10ps |
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Frequency Range |
1Hz ~ 2 MHz |
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Laser power |
16W @ 400kHz |
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Single pulse energy |
> 200μJ |
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Laser frequency |
400 kHz to 1000 kHz |
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Galvanometer maximum scanning speed |
3000mm / s |
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Maximum scan range |
50mm × 50mm |
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Focus spot |
20 ± 5 μm |
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Maximum processing format |
650mm × 550mm, single-head dual platform |
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Worktable XY axis movement maximum speed |
800mm / s |
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Worktable XY axis positioning accuracy |
± 3 μm |
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Worktable XY axis repeat positioning accuracy |
± 1 μm |
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Precision |
± 20μm |
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Cutting material |
FPC, CVL, FPC micro-connection, ceramics, silicon and so on |
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Cutting material thickness |
|
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File format |
* .gbr & * .dxf & * .lay |
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Power and power |
AC220V 50Hz / 2.5kW; AC380V 50Hz / 5.5kW |
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Dimensions |
Length × width × height = 2200mm × 2150mm × 1750mm (excluding 3 color lights) |
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Weight |
3000Kg |
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Environment temperature |
20 ° C ± 2 ° C |
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Environment humidity |
≤ 60% RH, non-condensing Non-condensing |
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Equipment gas source |
|
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Ground amplitude |
≤ 5μm |
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Ground pressure |
2000kgf /㎡ |
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