Reliable TE-175 Dual-Axis Fixture for Firmly Clamping Mobile Parts During Repairs
描述
多功能手机芯片主板固定夹治具TE-185 TE-173 TE-175通用耐高温焊接夹,用于固定和维修手机PCB/iPhone部件,例如CPU,WIFI IC,Nand闪存芯片等。
TE-173双板夹持,单轴螺旋夹持。旋转轴锁定主板或IC可以更好的固定而不会反弹。TE-175应用范围广泛,苹果和安卓芯片电缆专用夹持位置,支持异形主板,还支持夹持芯片电缆进行除胶和镀锡。
选项:
1.TE-173单轴芯片主板夹具。
2.TE-175双轴芯片主板夹具。
3.TE-185最小芯片主板夹具。
特点:
1.耐高温材料:夹具可耐高温,确保工作时不变形,确保设备使用寿命。
2.调整方便:配备快速调整机构,可轻松调整固定角度及高度。
3.携带方便,适合多种工作场所使用。
4.夹紧力强:可牢固固定各种形状、尺寸的零件。
在线联系供应商
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