BGA reballing tools solder wick desoldering wire for chips cleaning
100% Japan original goot wick,width 3mm,length 1.5mm,was used for cleaning the removal tin on BGA
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High Quality BGA Accessory Solder Flux Paste no clean 218 |
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BGA reballing tools solder wick desoldering wire for chips cleaning |
100% Japan original goot wick,width 3mm,length 1.5mm,was used for cleaning the removal tin on BGA |
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Shuttle star BGA reballing kit for IC chip renew and rework |
Easy to operate,automatic lock and unlock system,two screw four corners positioning at the same time,with tin balls storage and pull out groove |
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Pure tin 99.9% lead solder balls for computer chips reballing |
Specical for bga,lead soldering balls 0.25-0.76mm,25W grain one bottle |
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