Glass-Metal Hermetic Feedthroughs Packages for industrial manufacturing machinery
Sinopack provides glass hermetic feedthroughs and connectors based on its glass-to-metal sealing technology. These glass hermetic feedthroughs are used for a diverse range of applications from industrial manufacturing machinery such as semiconductor manufacturing equipment to scientific and technological equipment.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Hermetic Ceramic Packages for MEMS Sensors | Sinopack offers hermetic ceramic packages with superior mechanical properties, suitable for small, high density, and surface mountable applications... |
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Custom-Designed Ceramic Packages and Optical Filters for Image Sensors | Sinopack provides standard and custom-designed ceramic packages for CCD and CMOS image sensors. Sinopack devotes to the R&D and manufacturing o... |
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25Gbps Ceramic Leadless Chip Carriers (CLCC) for Modulator Drivers | Surface Mount Packages Low Insertion Loss: -1dB min. (DC~32GHz) Low Return Loss: -15dB max. (DC~32GHz) Cu-Mo Heat Sink Sinopack devotes to the R&am... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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