Glass-Metal Hermetic Feedthroughs Packages for industrial manufacturing machinery
Sinopack provides glass hermetic feedthroughs and connectors based on its glass-to-metal sealing technology. These glass hermetic feedthroughs are used for a diverse range of applications from industrial manufacturing machinery such as semiconductor manufacturing equipment to scientific and technological equipment.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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TOSA Ceramic Packages for Micro Integrable Tunable Laser Assembly (µ-ITLA) | Low Return Loss: -15dB max. (DC~15GHz) Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC,... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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