Glass-Metal Hermetic Feedthroughs Packages for industrial manufacturing machinery
Sinopack provides glass hermetic feedthroughs and connectors based on its glass-to-metal sealing technology. These glass hermetic feedthroughs are used for a diverse range of applications from industrial manufacturing machinery such as semiconductor manufacturing equipment to scientific and technological equipment.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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TO-254 and TO-257 Ceramic Packages for Power Electronics |
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Sinopack Ceramic Packages for High Power Laser Devices |
Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conduct... |
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Sinopack Standard Ceramic Packages with Lids for Device Evaluation |
Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP)... |
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