Copper Base Copper Clad Laminate

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Specification:

1. Thermal conductivity:1.5W/m.k
2. Dielectric thickness: 100um-350um
3. Copper CCL thickness:0.6mm
4. Copper foil:1OZ
5. Supply size:500×600mm/400×1200mm/500×1200mm/600×1200mm,We can supply other size upon request.

Feature:

1. Meet the ROHS requirements
2. Excellent thermal conductivity
3. Solder excellent performance
4. Outstanding reliability
5. Good machinability
6. Excellent dimensional stability
7. Electromagnetic wave shielding

Application:

1.High degree of LED lighting

2.LED blacklight

3.High power electronics components(high-power transistors,rectifiers)

4.Vehicle use (rectifier,power module)

8.Audio (equalizer,amplifier)

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	Aluminum Copper Clad Laminate	Specification: CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k Dielec...
	Aluminum Base Copper Clad Laminate	Specification: CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k Dielec...
	Copper Base Copper Clad Laminate	Specification: Thermal conductivity:1.5W/m.k Dielectric thickness: 100um-350um Copper CCL thickness:0.6mm Copper foil:1OZ Supply size:500&ti...
	Copper Clad Laminate	Specification: CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k Dielectri...

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