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Copper Clad Laminate

Specification:

CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm

Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k

Dielectricthickness:80um-150um

Copperfoil:1OZ,2OZ,3OZ

Supplysize:500*600mm/400*1200mm/500*1200mm/600*1200mm,Wecansupplyothersizeuponrequest.

ItemNo.:AL-H-06

Feature:

MeettheRoHSrequirements

Excellentthermalconductivity

Solderexcellentperformance

Outstandingreliability

Goodmachinability

Excellentdimensionalstability

Electromagneticwaveshielding

Application:

Coppercladlaminateistheelectronicindustrialbasematerial,mainlyusedforthemanufactureofprintedcircuitboard(PCB),widelyappliedintelevision,radio,computer,mobilecommunicationsandotherelectronicproducts.


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