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BGA 268 test sockets BGA 268 testing /testing solution

Produced by: Shenzhen YounRongDa micro electronics technology co.Ltd

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ShenzhenYounRongDamicroelectronicstechnologyco.Ltdisaprofessionalsemiconductortestprogramdevelopment,manufacturingandsalesenterprises,withtenyearsofresearchandtestingsocketmakingexperience,.Wemainlyprovidechiptestsocket,burningfixture,programmingdevice,EMMC/TSOPtestsocket,camerachiptestsocket(sensor),automatedtestsocketandconnectortesting.

Contact:Gracexie

Email:sabbatiaat163dotcom

Phone:

Mobile:

BGA268testsocketfeature

SIZE:17X17(mm)

Pin:268

PITCH:0.8

  1. Uppercoveradopthandrotatestructure,sensitiveoperation.2.Pressplateofsocketheadadopthumanizationstructure,balancepress,guaranteeICpressequality,andwon’tskewing.3.CrownshapeofPogopinbeabletobreakoxidelayerofsolderball,contactstable,protectsolderballshape.4.Rationalizationlocatingslot,GuideholecanmakesureIClocationright.5SpecialICsupportplatestructure,protectPogopinfreeofoutsideforce.
  2. importPogopin,BECUplatedhardgolden,rhodium.Worklifetimeover100000times.
  3. Lowcostformaintenance,easytochangepin,costefficiency.
  4. Matureworkingaccuracyrange:pitch=0.3mm

10.Deliverytime:inthreedaysearliest.



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