rigid PCB
Rigid PCB Capability
项目 技术指标
Item Specifications
加工层数 2-22层
Layers 2-22Layer
最小线宽/线距 Min Wire Width/Space
内层(Inner) 0.5OZ 3 Mil/3Mil
1OZ 3.5Mil/3.5Mil
外层(Outer) 50µm 4Mil/3.5Mil
最小孔径 机械孔0.2mm (CNC Hole)
Min Hole Size激光孔0.1mm (Laser Hole)
板厚
Board Thickness 0.6mm-10mm
板面尺寸Board Size: 610X1100mm
表面处理：
Surface Treatment:
无铅喷锡，OSP, 电金，化金，化银，化锡，电锡，闪金
LeadfreeHASL,Immersion Gold ,Immersion Tin,Immersion Silver,Gold Finger Plating,OSP,HT OSP,IMG+AU finger,
OSP+AU finger,Immersion Gold & Selective OSP
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rigid PCB | Rigid PCB Capability 项目 技术指标 Item Specifications 加工层数 2-22层 Layers 2-22Layer 最小线宽/线距 Min Wire Width/Space 内层(Inner) 0.5OZ 3 Mil/3Mil 1OZ... |
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HDI PCB | HDI Capability Item Specification (Min Wire Width/Space) Cu Foil) 2.5Mil/3Mil (Plated Layer) 3Mil/3Mil (Min Through Hole Size) 0.2mm (Min ... |
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