HDI PCB
HDI Capability
Item Specification
(Min Wire Width/Space)
Cu Foil) 2.5Mil/3Mil
(Plated Layer) 3Mil/3Mil
(Min Through Hole Size) 0.2mm
(Min Buired Hole Size) 0.15mm
(Min Core Thickness)
Non Plated 0.05mm
Plated 0.065mm
(Max Board Thickness) 2mm
(Max Layers) 14 Layer
(Stack Up type)
1+N+1, 2+N+2, 3+N+3,4+N+4
(Available Material)：
EM220/EM320/TU752/TU662/EM285(HF)/EM280(HF)/NPG-TL(HF)
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rigid PCB | Rigid PCB Capability 项目 技术指标 Item Specifications 加工层数 2-22层 Layers 2-22Layer 最小线宽/线距 Min Wire Width/Space 内层(Inner) 0.5OZ 3 Mil/3Mil 1OZ... |
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HDI PCB | HDI Capability Item Specification (Min Wire Width/Space) Cu Foil) 2.5Mil/3Mil (Plated Layer) 3Mil/3Mil (Min Through Hole Size) 0.2mm (Min ... |
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