printed circuit board

BaseMaterials:

CEM-1 CEM-3 FR-4 Teflon Rogers etc.

Layers:

Focus in 1-8 layers

Min Core material thickness:

3mil(excluding copper)

Prepregtype:

7628 2116 1080 3313

Max Board size:

520*720mm

Copper thickness

Base copper 1/3 OZ, HOZ, 1OZ, 2OZ,3OZ, 4OZ；Max Finished copper 6 OZ

Min Board thickness

2-layer 10mil; 4-layer 16mil; 6-layer 24mil; 8-layer 32mil; 10-layer 40mil

Max Board thickness

236mil(finished)

Min Line width/space

3mil/3mil

Min Through hole size

8mil

PTH wall copper thickness

≥1mil

Hole size tolerance

PTH±3mil, NPTH±2mil

Aspect ratio

8:1

V-CUT:

Angles 30°/45°/60°(+/-5°); Remain THK tolerance±4mil

Hole positional deviation

1st-drill ±3mil(Normal), ±2mil(Advanced); 2nd-drill ±4mil

Min Solder mask bridge:

3mil

Outline tolerance:

±4mil(Rout), ±5mil(Punch)

Twist & Bow

≤0.75%(Normal), ≤0.5%(Advanced);

Surface finish

HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F

Insulation Resistance

>10MΩNormal

Through hole resistance

≤0.05ΩNormal

Peel strength

1.4N/mm

S/M abrasion

>5H

Thermal stress

288℃ 10Sec 3times

Test Voltage

200-300V