printed circuit board
Base Materials: CEM-1 CEM-3 FR-4 Teflon Rogers etc. Layers: Focus in 1-8 layers Min Core material thickness: 3mil(excluding copper) Prepreg type: 7628 2116 1080 3313 Max Board size: 520*720mm Copper thickness Base copper 1/3 OZ, HOZ, 1OZ, 2OZ,3OZ, 4OZ；Max Finished copper 6 OZ Min Board thickness 2-layer 10mil; 4-layer 16mil; 6-layer 24mil; 8-layer 32mil; 10-layer 40mil Max Board thickness 236mil(finished) Min Line width/space 3mil/3mil Min Through hole size 8mil PTH wall copper thickness ≥1mil Hole size tolerance PTH±3mil, NPTH±2mil Aspect ratio 8:1 V-CUT: Angles 30°/45°/60°(+/-5°); Remain THK tolerance±4mil Hole positional deviation 1st-drill ±3mil(Normal), ±2mil(Advanced); 2nd-drill ±4mil Min Solder mask bridge: 3mil Outline tolerance: ±4mil(Rout), ±5mil(Punch) Twist & Bow ≤0.75%(Normal), ≤0.5%(Advanced); Surface finish HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F Insulation Resistance >10MΩ Normal Through hole resistance ≤0.05Ω Normal Peel strength 1.4N/mm S/M abrasion >5H Thermal stress 288℃ 10Sec 3times Test Voltage 200-300V
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printed circuit board | Base Materials: CEM-1 CEM-3 FR-4 Teflon Rogers etc. Layers: Focus in 1-8 layers Min Core material thickness: 3mil(excluding copper) Prepreg type: 7... |
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printed circuit board | BaseMaterials: CEM-1 CEM-3 FR-4 Teflon Rogers etc. Layers: Focus in 1-8 layers Min Core material thickness: 3mil(excluding copper) Prepregtype: ... |
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printed circuit board | BaseMaterials: CEM-1 CEM-3 FR-4 Teflon Rogers etc. Layers: Focus in 1-8 layers Min Core material thickness: 3mil(excluding copper) Prepregtype: ... |
