Benchtop High-Precision Material Thermal Conductivity Tester (Guarded Hot Plate Heat Flow Meter Method)

Whats/App: +86 156 1874 6768

Web: standard-groups.com

Benchtop High-Precision Material Thermal Conductivity Tester (Guarded Hot Plate Heat Flow Meter Method) is a high-precision instrument designed to measure thermal conductivity and thermal resistance of materials using the widely accepted guarded hot plate heat flow meter method. The instrument applies a stable temperature on one side of the sample, measures the heat flow transmitted to the cold side, and calculates thermal conductivity and thermal resistance automatically. Featuring imported sensors and advanced computer control, the system ensures high measurement accuracy, reliability, and excellent repeatability. It is particularly suitable for low thermal conductivity materials (accurate to 0.1 mW/m·K) and can be used to test plastics, rubber, insulation materials, aerogel panels, vacuum glass, and more. This instrument is widely applied in universities, research institutes, quality inspection agencies, and industrial enterprises.

Application

The tester is suitable for:

Plastics, rubber, and insulation materials

Aerogel panels and vacuum glass

Low thermal conductivity materials requiring high-precision measurement

Common applications include:

University and academic research: Material thermal property analysis

Industrial quality inspection: Ensuring material thermal performance

R&D laboratories: Testing new insulation or thermal management materials

Factory and production control: Material screening for thermal conductivity

Standards

The instrument complies with:

GB/T 10295-2008 – Steady-state thermal resistance and related characteristics of thermal insulation materials using the heat flow meter method

ASTM E1530 – Standard Test Method for Evaluating the Steady-State Thermal Transmission Properties of Materials

ASTM C518-04 – Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus

Parameters

Item	Specification
Thermal conductivity range	0.0001–1 W/m·K (accurate to 0.1 mW/m·K); 0.001–300 W/m·K
Measurement accuracy	±1%
Sample size	50 × 50 to 150 × 150 mm; thickness ≤50 mm
Sample types	Solid and powdered materials
Measurement time	15–20 min
Hot plate temperature range	Room temperature–99.9 °C (standard); optional up to 499.9 °C; precision 0.1 °C
Cold plate temperature range	0–99.9 °C (standard); optional -10–99.9 °C; precision 0.1 °C
Pressure range	0–1000 N; precision 0.1 N
Sample thickness measurement	0–50 mm; resolution 0.1 μm
Heat flux sensor	Imported heat flux meter, stable and reliable
Automation	Full computer-controlled measurement, data storage, and report printing

Features

High-precision measurement for low thermal conductivity materials

Full automation from temperature control, pressure application, to data acquisition and report generation

Imported heat flux sensors for reliable and repeatable measurements

Accurate pressure application and sample thickness measurement for enhanced precision

Suitable for both solid and powdered samples

Compact benchtop design for laboratory convenience

Accessories

Main instrument

Analysis software (Chinese and English version)

HX-1005 precision low-temperature constant temperature water bath (temperature control ±0.01 °C)

Computer (e.g., Lenovo or user-selected)

Calibration reference sample

Test Procedures

Prepare the sample ensuring flat, parallel surfaces and proper dimensions.

Place the sample between the hot and cold plates.

Set the desired hot and cold plate temperatures using the computer software.

Apply controlled pressure to the sample via computer-controlled clamp.

Start the measurement; the system automatically measures heat flow and sample thickness.

Wait 15–20 minutes for the steady-state thermal condition.

Software calculates thermal conductivity and thermal resistance and generates a report.

Store or print measurement results as needed.

Maintenance Information

Keep hot and cold plates clean and free from dust or residue.

Regularly calibrate the instrument using standard reference samples.

Check the heat flux sensor for proper connection and stability.

Maintain stable laboratory environmental conditions to ensure measurement accuracy.

Ensure proper water bath operation for cold plate stability.

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