TE-720 double-sided magnetic silicone mat for BGA chips tinning soldering repair. High temperature resistant strong magnetic chip positioning 4-in-1 silicone pad, with 0.3mm 0.4mm 0.7mm 0.8mm thickness chip groove for easy glue removal and tinning. BGA chip tinning insulation pad for iPhone BGA CPU IC welding and repair.
Features:
1. Soft silicone material, high temperature resistant and easy to clean, strong magnetic adsorption does not shift.
2. Strong magnetic adsorption design makes the steel mesh not easy to fall and shift, and tinning is more firm and stable.
3. The design of the heat dissipation hole alows the steel mesh to plant tin without bulging.
4. Comes with 0.3-0.4-0.7-0.8M thickness chip groove, easyto remove glue and planttin.
5. High temperature resitance with adhesion can play a non-slip effect.
6. Double-sided use of four different depths can use a variety of chips.
TE-720 double-sided magnetic silicone mat for BGA chips tinning soldering repair. High temperature resistant strong magnetic chip positioning 4-in-1 silicone pad, with 0.3mm 0.4mm 0.7mm 0.8mm thickness chip groove for easy glue removal and tinning. BGA chip tinning insulation pad for iPhone BGA CPU IC welding and repair.
Features:
1. Soft silicone material, high temperature resistant and easy to clean, strong magnetic adsorption does not shift.
2. Strong magnetic adsorption design makes the steel mesh not easy to fall and shift, and tinning is more firm and stable.
3. The design of the heat dissipation hole alows the steel mesh to plant tin without bulging.
4. Comes with 0.3-0.4-0.7-0.8M thickness chip groove, easyto remove glue and planttin.
5. High temperature resitance with adhesion can play a non-slip effect.
6. Double-sided use of four different depths can use a variety of chips.
