Керамические печатные платы
基材类型:氧化铝/氮化铝陶瓷基材厚度:定制导电层:铜金属层厚度:定制表面处理:浸金/重银/ osp金属单面/双面:单面/双面
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Ceramic metallization | 电子封装要求基板材料满足高绝缘性,低介电常数,并且芯片具有热膨胀系数,良好的加工性能,较高的机械强度要求。由于陶瓷基板系数的特性,在电子封装应用(例如LED,CPV和绝缘栅双极型晶体管)中,良好的调谐性,耐热性,绝缘性和芯片匹配的热膨胀性被激光二极管封装得到了更广泛的应用。通过LED照明和传感... | |
Slitong ceramicPCB | 产品特点: 1.织物形状无限制 2.激光打印3D 布线3 ..,无掩膜,响应速度快 4 ..技术成熟,环保,无污染 5.定制生产,无需开模,生产周期短 6,不含有机成分,耐宇宙辐射,航空在航天中可靠性高,使用寿命长。 7.可以进行高密度组装,线/节距(L / S)分辨率可以达到20μm... | |
Ceramic substrate manufacturers | style="vertical-align: inherit;">微信:yjqp3344 | |
Ceramic circuit board | 基板名称:其他陶瓷PCB基板材料厚度:3mm 导电层:Cu 金属层厚度:100μm 表面处理:OSP 金属单面/双面:双面 镀铜通孔:无 阻焊:无 | |
Керамические печатные платы | 基材类型:氧化铝/氮化铝陶瓷基材厚度:定制导电层:铜金属层厚度:定制表面处理:浸金/重银/ osp金属单面/双面:单面/双面 |
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