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XK-S40

Features

Thermal conductivity 4.0W/mK

Conforming, ideal for delicate conponent

and low stress applications

Cure at room or elevated temperature

1:1, no cure by-product

Applications

Automotive electronics;

Electricvehicle battery pack;

Computer and peripherals;

Between any heat-generating

semiconductor and a heat sink;

XK-S40is a two part, thermally conductive gap filling material that features slump resistance and low stress. It cures atroom temperature and can be accelerated by elevated heat.It offers various thickness withlittle or no stressto components during assemly, suitable for automated dispensing system, dispensing rate and doseare programmable and controlled.

Description

GLPOLY Two-component thermal gap filler XK-S40 is one of the few that can surpass Gap Filler TGF3600. GLPOLY XK-S40 can endure high temperature ageing test as well as extreme temperature shock. It has been widely used in automotive applications for high performance, low thermal resistance and low oil leakage.

In the past, a lot of thermal management engineers selected TGF 3600 or other imported products, but it was changed. Many projects were delayed by long lead time and logistics due to COVID-19 epidemic. They were in urgent need of a substitute from local market.

For high-end devices, such as rail transit, medical equipment, industrial control and automotive applications etc, reliability is the most important factor. GLPOLY XL-S40 thermal gap filler is such a material for high-end devices.

Earlier 2019, we had a project with a power battery manufacturer in Jiangxi. He requested thermal gap filler to be verified by a third party for reliability including 1.HAST: 85 Celsius degree, RH 85% for 600/900/1200/1500 hours; 2. speedy temperature altering test: from minus 40 to 130 Celsius degree for 192/288/383 cycles and high and low temperature shock: from minus 40 to 130 Celsius degree 500 cycles. 20 items of material would be compared before and after this reliability test and test report should be issued by the third party. There was an special test carried out in GLPOLY Lab: reliability test of material under given compression. the solution and fixtures were designed by GLPOLY. After customer analyzed the result of simulating test, they thought this report was more reliable and moroe real than the tests made by third party about ageing situation of material.

The reliability and performance of GLPOLY thermal gap filler has been verified by third party, which was equivalent to imported products, even better. What’s more, GLPOLY offered a favorable price which was 30% lower thatn that of other top-class brands.

GLPOLY has introduced automated production line, offering 12 tons per 8 hours per shift, eliminating human error, keeping consistency of products. GLPOLY thermal gap filler has been applied to EV battery pack, motor and electronic control units and more in volume production.

GLPOLY has collaborated with DT Mobile, LG, DJI, GAC NE, Xiaokang Motor, Lixiang Motor, NIO Motor and more, providing them with exceptional performance thermal interface materials to help them devices that run cooler and reliably.

With GLPOLY, you can be rest assured of thermal management.

GLPOLY XK-S40thermal gap filler is supplied in two component, designed for automotive applications, such as battery pack, motoretc. This materialhas been appliedin leading enterprisessuch as Xiaokang Motor, Welling Motor, Farasis Energy, Leap Motoretc:

1. Thixotropic nature makes it easy to dispense; flows under low compressive force, decreasing stress on component, thus decreasing component failuries;

2.Suitable for automated dispense processes, decreasing installation cost;

3. Ideal for uneven topography, deforms under low compressive force, decreasing stress on component;

4. Cures into sheet, in place of thermal gap pad for ease of maintenace;

5. Accommodates a variety of bond line thickness to multiple devices;

6. Proven reliability under low and high temperature thermal cycling,10-year service life;

GLPOLY XK-S40 isa high performance, thermally conductive, liquid gap filling material with 4.0W/mK thermal conductivity.This material isthixotropic and has excellent slump resistance.It issupplied in two component, andiscompatible with high volume,automated dispense processes. Ideal for fragile, low stress applications, and in place of thermal gap pad.



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