Shenzhen Goldlink Tongda electronics Co,.Ltd

GLPOLYis a leading enterprise in the field of thermal conductive materials and thermal management solutions.At Goldlink, developing high quality thermal interface materials and thermal solutions for the electronics industry is our top priority.

We serve a wide range of industries worldwide, including automotive, computing, 5G telecommunications, consumer electronics, LED lighting, solar, military and power conversion..We pride ourselves on fast sampling, an extensive product portfolio and best-in-class technical support.

As a professional manufacturer of thermal interface materials, we understand the issues and we know that there is always a better way to help you achieve your goals and objectives.

GLPOLY focuses on a single purpose - discovering needs, then developing and delivering advanced thermal solutions through dedication and innovation.

Products:

	Shenzhen Goldlink Tongda electronics Co,.Ltd	GLPOLYis a leading enterprise in the field of thermal conductive materials and thermal management solutions.At Goldlink, developing high quality t...
	XK-P20	Features Conformable, low hardness Excellent compressible Good electrical insualtion Low strain for delicate components Applicat...
	XK-P30	Features High thermalperformance Conformable, low hardness Excellent compressible Good electrical insualtion Low strain for delicate components ...
	XK-P45	Features High thermal conductivity 4.5W/mK Conformable, low hardness Good electrical insulation Applications Automotive electronics Digital...
	XK-P50	Features High performance Low thermal impedance Good electrical insualtion Easy assembling Applications Automotive electronics Digital disk ...
	XK-P60	Features Thermal conductivity 6.0W/mK Low thermal impedance Good electrical insualtion Easeofhandling Applications Automotive electronics Di...
	XK-P110	Features Thermal conductivity 11.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electronics...
	XK-P110	Features Thermal conductivity 11.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electronics...
	XK-P80	Features High thermal conductivity 8.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electroni...
	XK-S20	Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
	XK-S20	Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
	XK-S40	Features Thermal conductivity 4.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
	XK-S30	Features Thermal conductivity 3.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
	XK-S25	Features High performance Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure ...
	XK-S15	Features Thermal conductivity 1.5W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
	XK-G32	Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applica...
	XK-G80	Features Thermalconductivity8.0W/mK Wetoutsurface,nopumpout Lowcompressionforce Conformingwithwetout Ultralowstressoncomponent Applications A...
	XK-G60	Features Thermalconductivity6.0W/mK Lowthermalimpedance Ultralowcompressionforce Long-termreliability Designforlowstressapplication Applicatio...
	XK-G50	Features Thermal conductivity 5.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application App...
	XK-G40	Features Thermal conductivity 4.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application App...
	XK-G20	Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applic...
	XK-D20L	Features Thermalconductivity2.0W/(m.K),lowstress Excellentelectricalinsulation,bondingstrength≥13Mpa Applicationtemperature:-45~175℃,Shortterm...
	XK-D12	Features Fillinggapsbetweenheatsourceandheatsink Excellentelectricalinsulation,bondstrength≥13Mpa Applicationtemperature:-45~175℃,Shortterm:25...
	XK-D30	Features Thermalconductivity3.0W/(m.K),flammabilityUL94-V0 Excellentelectricalinsulation,bondingstrength≥13Mpa Applicationtemperature:-45~123℃...
	PCM XK-C16	Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Good electrical ...
	XK-GN30	Features High thermal performance Low thermal resistance Ultra conforming Low stress, non pump-out Applications Automotive electronics Coms...