AC380V 50HZ SMT Wave Soldering Machine High Power For Full Production Line

CNSMT rich in WAVE SOLDERING develop MACHINE on SMT FULL LINE

Feature

Control method: Press Kin+PLC (Kelita PCBASE wave soldering control software V1.0)

Transport Motor: 1P AC220V, 60W

Transport speed: 0～2000mm/min

Board size: 30 to 300mm(w)

Flux capacity: 6L

Pre-heating zone: 1300mm three-stage preheating, 600w*10PCS room temperature～250°C

Tin furnace heating: 1.2KW * 9PCS room temperature ~ 300 °C

Tin furnace capacity: 210KG (lead and tin materials are used)

Peak height: 0～12MM

Crest Motor: 3P AC220V, 0.18KW*2PCS

Washing claw pump: 1P AC220V 6W

Transport direction: Left → Right

Welding angle: 3 ~ 6 o

Flux Pressure: 3 to 5 BAR

Power Supply: AC380V 50HZ

Normal operating power / total power: 5KW/18KW

Dimensions: 3600(L)*1200(W)*1650(H) MM

Body size: 2700(L)*1200(W)*1650(H) MM

Net weight: 890KG

Application

Failure analysis

Fold residue more

1. FLUX has a high solids content and does not contain too much volatiles.

2. The preheating is not performed before welding or the preheating temperature is too low (the time is too short for dip soldering).

3. Take the board too fast (FLUX failed to fully evaporate).

4. Tin furnace temperature is not enough.

5. There are too many impurities in the tin furnace or the tin is low.

6. Added anti-oxidant or anti-oxidation oil.

7. Apply too much flux.

8. There are too many scorpions or open components on the PCB and there is no warm up.

9. The component legs and plate holes are out of proportion (the holes are too large) to increase the flux.

10. The PCB itself has pre-coated rosin.

11. In the tin-bismuth process, FLUX is too wettable.

12. PCB process problems, too few vias, causing FLUX volatility.

13. Hand solder immersed in the wrong angle of the PCB.

14. During the use of FLUX, no diluent was added for a long time.

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