HDI电路板
HDI Capability
项目 技术指标
Item Specification
最小线宽/线距 (Min Wire Width/Space)
下料铜厚(Cu Foil) 2.5Mil/3Mil
成品铜厚(Plated Layer) 3Mil/3Mil
最小通(Min Through Hole Size) 0.2mm
最小埋孔(Min Buired Hole Size) 0.15mm
最小芯板厚度 (Min Core Thickness)
电镀前-Non Plated 0.05mm
电镀后-Plated 0.065mm
最大板厚 (Max Board Thickness) 2mm
最大层数 (Max Layers) 14 Layer
叠层结构(Stack Up type)
1+N+1, 2+N+2, 3+N+3,4+N+4
可选材料(Available Material)：
EM220/EM320/TU752/TU662/EM285(HF)/EM280(HF)/NPG-TL(HF)
在线联系供应商
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HDI电路板 | HDI Capability 项目 技术指标 Item Specification 最小线宽/线距 (Min Wire Width/Space) 下料铜厚(Cu Foil) 2.5Mil/3Mil 成品铜厚(Plated Layer) 3Mil/3Mil 最小通(Min Thro... |
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rigid PCB | Rigid PCB Capability 项目 技术指标 Item Specifications 加工层数 2-22层 Layers 2-22Layer 最小线宽/线距 Min Wire Width/Space 内层(Inner) 0.5OZ 3 Mil/3Mil 1OZ 3... |
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