HDI电路板
HDI Capability
项目 技术指标
Item Specification
最小线宽/线距 (Min Wire Width/Space)
下料铜厚(Cu Foil) 2.5Mil/3Mil
成品铜厚(Plated Layer) 3Mil/3Mil
最小通(Min Through Hole Size) 0.2mm
最小埋孔(Min Buired Hole Size) 0.15mm
最小芯板厚度 (Min Core Thickness)
电镀前-Non Plated 0.05mm
电镀后-Plated 0.065mm
最大板厚 (Max Board Thickness) 2mm
最大层数 (Max Layers) 14 Layer
叠层结构(Stack Up type)
1+N+1, 2+N+2, 3+N+3,4+N+4
可选材料(Available Material):
EM220/EM320/TU752/TU662/EM285(HF)/EM280(HF)/NPG-TL(HF)
Other supplier products
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rigid PCB |
Rigid PCB Capability
项目 技术指标
Item Specifications
加工层数 2-22层
Layers 2-22Layer
最小线宽/线距 Min Wire Width/Space
内层(Inner) 0.5OZ 3 Mil/3Mil
1OZ 3... |
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HDI电路板 |
HDI Capability
项目 技术指标
Item Specification
最小线宽/线距 (Min Wire Width/Space)
下料铜厚(Cu Foil) 2.5Mil/3Mil
成品铜厚(Plated Layer) 3Mil/3Mil
最小通(Min Thro... |
供应产品
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卖方: 杭州澄然芯科技有限公司 |
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滤波器、天线、巴伦、耦合器、三工器、射频基板等。
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声表滤波器双工器
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尺寸:
SMD类型: 3.0×3.0 /3.8×3.8 / 5.0×5.0 / 5.0×... |
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