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Double side 8 layers HDI PCB assembly manufacturing

Double side 8 layers HDI PCB assembly manufacturing

● 4 YAMAHA High-speed SMT Lines

● 6 million daily SMT placements capability

● 400,000 daily DIP placements capability

● 500×600 mm Maximum Board Size

● 0.25"x 0.25" Minimum Board Size

● 450 mm Max. Width for Wave-Solder

● Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT AssemblyFine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement

SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly

What is a high frequency (HF) PCB?

Electronic devices with high frequency is the developing tendency nowadays, especially in wireless network. Satellite communications are developing rapidly, and information products are moving towards high speeds and high frequency. Accordingly, developing new products always requires high-frequency substrates. These communication products, like satellite systems, mobile s, must use high-frequency PCBs.

The characteristics of high frequency PCB.

It has special materials requirements for the high frequency boards for wireless applications and data rates in the high GHz range:

In general, the high frequency can be defined as a frequency above 1 GHz. Currently, PTFE materials are widely used in high-frequency PCB manufacturing, also known as Teflon, and their frequencies are usually higher than 5 GHz. In addition, FR4 or PPO substrates can be used for product frequencies between 1 GHz and 10 GHz.

Check our HF PCB capabilities by reviewing below table:

Feature

Capability

Quality Grade

Standard IPC 2

Number of Layers

2 - 20layers

Build Time

2days - 5weeks

Material

RO4003C, RO4350B, Ro3003, Ro3010, RT5880 etc.

Board Thickness

Copper Weight(Finished)

Min Tracing/Spacing

3mil/3mil

Solder Mask Sides

As per the file

Solder Mask Color

Green, White, Blue, Black, Red, Yellow

Silkscreen Sides

As per the file

Silkscreen Color

White, Black, Yellow

Surface Finish

Electroless nickel/immersion gold (ENIG) - RoHS

Immersion silver - RoHS

Immersion tin - RoHS

Organic solderability preservatives - RoHS

Min Annular Ring

4mil

Min Drilling Hole Diameter

6mil

Impedance tolerance

±10%

Other Techniques

Peelable solder mask

Gold fingers

Carbon oil

Countersink holes

Let’s start to discuss your pcb boardtoday?Just click your favorite button in the right side.



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