Wafer Back Grinding Wheel
E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. E-Grind Wafer Back Grinding Wheel use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our wafer grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
Performance of Wafer Back Grinding Wheel
Leading technology
Good self-sharpening
No dressing required
High yeild rate of work-piece
Applications of Wafer Back Grinding Wheel
E-Grind wafer back grinding wheel serves various crucial applications in the LED and Semiconductor industries, primarily focusing on the back thinning process of wafers. The use of wafer back grinding wheel contributes to the production of high-performance semiconductor devices, microelectronics, and LED components, while also improving yield and cost efficiency in the manufacturing process.
Semiconductor Device Manufacturing:
Wafer back grinding wheels are extensively employed in the semiconductor industry for the manufacturing of integrated circuits (ICs) and other semiconductor devices. These wheels play a vital role in the thinning of semiconductor wafers, a critical step in the production of high-performance electronic components.
LED (Light-Emitting Diode) Production:
In the LED industry, wafer back grinding wheels are utilized for back thinning processes during the production of LED wafers. This is essential for achieving the desired thickness of the wafer while maintaining precision, as it impacts the optical and electrical properties of the final LED devices.
Microelectronics Manufacturing:
The precision and efficiency of wafer back grinding wheels make them indispensable in the production of microelectronic components. These components are integral to various electronic devices, including smarts, tablets, and other consumer electronics.
E grind, as an excellent cbn grinding wheel suppliers, offers a wide range of metal bonded diamond grinding wheels for you to choose from.
Other supplier products
|
|
Vitrified Bond Grinding Wheels |
The diamond and CBN are held in place by ceramic components that are fused to form the abrasive part of vitrified bond grinding wheels. Bond grindi... |
|
|
Electroplated Diamond Tools |
Electroplated diamond grinding wheels can be made in various shapes, so it will be an excellent option when the wheel is with complex profile. Per... |
|
|
Vitrified Bond Grinding Wheels |
Vitrified bond grinding wheelsare abrasive tools used for precision grinding across a range of industries. They are composed of abrasive grains, su... |
|
|
Internal Grinding Wheel |
Internal Grinding Abrasives E-Grind Vitrified CBN internal grinding wheels are widely used for grooving of vane pump rotors and synchromesh ball j... |
|
|
Metal Bond Grinding Wheels |
Metal bonded diamond grinding wheelsfrom Henan E-Grind Abrasives Co., Ltd. can function in a variety of wet or dry situations. Here at Henan E-Grin... |
供应产品
Same products
