Fiber-Optic Communication Modules ceramic Packages with Submounts and Lids
Sinopack produces an extensive range of packages for use in fiber-optic communication modules --including ceramic submounts, packages, lids. Our products are available both in custom configurations and in a broad line of standard designs.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Ceramic Packages for Uncooled Infrared Detectors | Existing packages using BTF structure, oxygen-free copper and package integration, has the characteristics of more fuses, high reliability. Maximum... |
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TO-254 and TO-257 Ceramic Packages for Power Electronics | Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies Sinopack devotes to the R&D and manufacturing of mu... |
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High Baud Rate Ceramic Packages for Integrated Coherent Receiver (ICR) | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch Sinopack devotes to the R&D and manufacturing of multilayer ceramic pa... |
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Sinopack Standard Ceramic Packages with Lids for Device Evaluation | Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP)... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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