Fiber-Optic Communication Modules ceramic Packages with Submounts and Lids
Sinopack produces an extensive range of packages for use in fiber-optic communication modules --including ceramic submounts, packages, lids. Our products are available both in custom configurations and in a broad line of standard designs.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Ceramic Packages for High Power Laser Devices | Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conduct... |
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Fiber-Optic Communication Modules ceramic Packages with Submounts and Lids | Sinopack produces an extensive range of packages for use in fiber-optic communication modules --including ceramic submounts, packages, lids. Our pr... |
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TO-254 and TO-257 Ceramic Packages for Power Electronics | Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies Sinopack devotes to the R&D and manufacturing of mu... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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TOSA Ceramic Packages for Micro Integrable Tunable Laser Assembly (µ-ITLA) | Low Return Loss: -15dB max. (DC~15GHz) Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC,... |
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