2UUL DA28 FlatCut Mobile Phone Filling Glue Quick Removal Blade Suitable for Mobile Phone PCB CPU IC Glue Cleaning and Removal
Description
2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades (5pcs/box) for Mobile Phone PCB CPU IC Glue Cleaning Removal without damaging the motherboard or CPU chip. 2UUL DA28 Phone Motherboard BGA Chip Repair Knife lightning fast scraper designed for removing residual glue and solder pads on circuit boards and mobile CPU PCB, convenient for cleaning.
Product Parameters:
Name: DA28 FLATCUT-Solder Pad Underfill Glue Fast Removal Blade (5 Pcs/Box)
Product Size: 37x9x0.5mm
Gross Weight: 14.5g
Package Size: 54.5x33x20mm
Net Weight: 5g(5 Pcs)
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