Repair mobile phone chips machine ZM-R6200 BGA Rework station with optical alignment vision system
ZM-R6200 BGA rework station
It is used to desolder and solder BGA Chips of computer, especially for mobile chips rework.
Samsung order 60 sets for their chips rework.
Specification parameters
|
1 |
Total power |
3600W Max |
|
2 |
Top heater power |
1200W （1st heater） |
|
3 |
Bottom heater power |
1200W （2nd heater） |
|
4 |
3rd IR heater |
1200W (Carbon fiber heating tube) |
|
5 |
power |
AC 220V±10 50/60Hz |
|
6 |
Electrical materials |
temperature control system Adopted Dalian University of Technology |
|
7 |
Dimensions |
L640*W630*H900mm |
|
8 |
Temperature control |
K-type thermocouple (Closed Loop), intelligent temperature compensation system |
|
9 |
Positioning |
V type groove，with universal fixture |
|
9 |
P C B size |
Max 410×370mm, Min65×65mm |
|
10 |
Available BGA chip |
1×1~ 80×80mm（min 0.04*0.04 inch） |
|
11 |
External temperature sensor |
1piece |
|
12 |
Net weight |
65kg |
|
13 |
Package |
Wooden box |
|
14 |
120KG |
|
|
15 |
Machine Dimension |
L75cm*W75cm*H90cm |
|
16 |
Wooden box dimension |
L78*W76*H104cm |
Feature:
- 3 independent heating systems
ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. Auto identifies a high degree of suction and mounting. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heater’s capacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.
- Precise optical alignment system
with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within 0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 inch HD monitor.
High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto focus, with automatic color resolution and brightness adjustment device.
3. Multi-function operation system
Touch screen interface shows current running temperature curves, what can be analyzed, saved. The temperature can be set to 6 segments and 6 segments constant temperature control,N groups of storage temperature setting parameters according to kinds of BGA chip set. With automatic soldering and desoldering functions
- Precise temperature control system
K-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, Temperature accuracy is within 1 degree.
Top hot air heater and mounting head is integrated design (2 functions all in). It can
- Superior safety functions
After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation.
Send product request
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