ZM-R5860C high efficient-cost BGA rework station for laptop chips repair

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ZM-R5860C BGA rework station

It could remove and replace BGA Chips of laptop, xbox360 and mobile etc.

1, Main Feature

, Y, Z axis all can do high positioning accuracy and fast maneuverability.
High definition touch screen made from Taiwan, PLC control, can save 50 groups profile and analyze instant temperatures curves, equipped with password protection and modify function. The temperature curves can be show on the touch screen. Instantly set and analyze temperature parameter according with repair need.
3 independent heating areas from top to bottom, the 1st and 2nd hot-air heaters, can be set many temperatures parameters and sections at the same time. The 3rd IR preheating, prevent the PCB motherboard cracking, and can be adjusted the power consumption. Bottom IR heater ensure an even heater for PCB board. Top heater can be adjusted freely; second hot air heater can be adjusted up and down.
The machine operations is easy to operate, human machine interface- high definition touch screen made from Taiwan

Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature. Temperature controlled within ±3 °.
a V-groove flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.
7. Powerful cross-flow fan rapidly cool the PCB board, built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.

8. After finished desoldering & soldering, there is an alarming & alarming in advance.

CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens. With a double over-heating protection control.
And It can save many temperature parameters, easy to repair same chips. And can repair Lead or Lead free chips, can meet repair of laptop, xbox360, mobile, ps3 and other components on the motherboard.

11, USB

12, Laser position could precisely put BGA Chip on the motherboard.

13, Constant temperature pause button ensure good welding effect.

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