陶瓷电路板
基板类型:其他陶瓷电路板
基础材料历史:3mm
导电层:铜
金属层厚度:100μm
表面处理:OSP
金属单面/双面:双面
镀铜通孔:无
阻焊:没有
在线联系供应商
Other supplier products
Ceramic metallization | 电子封装要求基板材料满足高绝缘性,低介电常数,并且芯片具有热膨胀系数,良好的加工性能,较高的机械强度要求。由于陶瓷基板系数的特性,在电子封装应用(例如LED,CPV和绝缘栅双极型晶体管)中,良好的调谐性,耐热性,绝缘性和芯片匹配的热膨胀性被激光二极管封装得到了更广泛的应用。通过LED照明和传感... | |
Slitong ceramicPCB | ||
Slitong ceramicPCB | 基材类型:氧化铝/氮化铝陶瓷基材厚度:定制导电层:铜金属层厚度:定制表面处理:浸金/重银/ osp金属单面/双面:单面/双面. | |
Slitong ceramicPCB | 衬底类型:氧化铝/氮化铝陶瓷衬底材料厚度:定制导电层:铜金属层厚度:定制表面处理:浸金/重银/ osp金属单面/双面:单面/双面 | |
陶瓷电路板 | 基板类型:其他陶瓷电路板 基础材料历史:3mm 导电层:铜 金属层厚度:100μm 表面处理:OSP 金属单面/双面:双面 镀铜通孔:无 阻焊:没有 |
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