.

陶瓷电路板

基板类型:其他陶瓷电路板

基础材料历史:3mm

导电层:铜

金属层厚度:100μm

表面处理:OSP

金属单面/双面:双面

镀铜通孔:无

阻焊:没有



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陶瓷电路板 基板类型:其他陶瓷电路板 基础材料历史:3mm 导电层:铜 金属层厚度:100μm 表面处理:OSP 金属单面/双面:双面 镀铜通孔:无 阻焊:没有
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